Description
The Intel® Ethernet Connection X557 family is a 10 Gigabit Ethernet (GbE) copper networking Physical Layer (PHY) for workstation, server, and embedded designs that have critical space and power constraints. The Intel® Ethernet Connection X557 family offers three design options: X557-AT (single 10 GbE PHY), the X557-AT2 (dual 10 GbE PHY), and the X557-AT4 (quad 10 GbE PHY)that provides connectivity for Network Interface Cards (NICs) and LAN on Motherboard (LOM) applications that require 10GBASE-T capability.
Power Savings
Power efficiency is critical to IT specialists as energy consumption is a real OpEx concern:
Energy Efficient Ethernet (EEE) reduces power consumption during periods of low data activity. Energy is used to maintain the physical layer transmitters in a ready state to transmit data on the wire. During periods of low data traffic, EEE sends a low-power-idle signal to put the transmitters into a low power state saving power and cost. When data needs to be sent, EEE sends a normal idle signal to wake up the transmit system before data is due to be sent so there is no degradation of performance.
- Validated with Intel® Xeon® Processor D-based System-ona-Chip (SoC) Product Family and Intel® Ethernet Controller XL710 family
- Single-port, dual-port, and quad-port 10GBASE-T PHY network interface
- Low power: 3.4 W/port
- Multi-speed: 100BASE-T, 1000BASE-T, and 10GBASE-T
- Designed to be used in conjunction with a triple-speed MAC interface. Interfaces supported: KR, XFI, KX, and SGMII
- IEEE 802.3az EEE (Energy Efficient Ethernet) Compliant
- On-die thermal sensor - Enables deployment in thermally constrained environments along with alarm and warning thresholds
- External SPI Flash interface
- Integrated MDI filter and advanced RFI cancellation
- 19 x 19 mm (single/dual port) or 25 x 25 mm (quad port) flip-chip BGA package
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